三星陶瓷电容规格书

■INTRODUCTION

MLCC(MultilayerCeramic Capacitor) is SMD(SurfaceMounted Device) type capacitor that is used in wide ranges of capacitance. MLCC is paid more attentions than other capacitors due to the better frequency characteristics, higher reliability, higher withstanding voltage and so on.

MLCC is made of many layers of ceramic and inner electrodes like sandwich. Pd was used for inner electrodes. But the price of Pd was skyrocketed and Pd was replaced by the BME(BaseMetal Electrode), which reduced the total cost of MLCC.

This inner electrode is connected to outer termination for surface mounting, which is composed of three layers, Cu or Ag layer, Ni plating layer, and SnPb or Sn plating layer. Most of MLCCs become Pb free by the environmental issue at present.

MLCC is divided into two classes. Class I(C0G,etc) is the temperature compensating type. It has a small TCC(TemperatureCoefficient of Capacitance) and a better frequency performance. Therefore, it is used in RF applications such as cellular phone, tuner, and so on. Class II(X7R,X5R, Y5V, etc) is the high dielectric constant type, which is used in general electronic circuit. Especially high capacitance MLCC is replacing other capacitors (Tantalumand Aluminum capacitor) due to the low ESR(EquivalentSeries Resistance) value.

■FEATURE AND APPLICATION

●Feature -Miniature Size

-Wide Capacitance and Voltage Range -Highly Reliable Performance

-Tape &Reel for Surface Mount Assembly -Low ESR

-High Q at High Frequencies

-Stable Temperature Dependence of Capacitance ●Application

-High Frequency Circuit(Tuner,VCO, PAM etc) -General Power Supply Circuit(SMPSetc) -DC-DC Converter

-General Electronic Circuit

■

STRUCTURE

■APPEARANCE AND DIMENSION

CODE [**************]5

EIA CODE

[***********][1**********]220

0.6±0.031.0±0.051.6±0.12.0±0.13.2±0.23.2±0.34.5±0.45.7±0.4

DIMENSION (mm ) W 0.3±0.030.5±0.050.8±0.11.25±0.11.6±0.22.5±0.23.2±0.35.0±0.4

T (MAX)0.3±0.030.5±0.050.8±0.11.25±0.11.6±0.22.5±0.23.2±0.33.2±0.3

BW 0.15±0.050.2+0.15/-0.10.3±0.20.5+0.2/-0.30.5+0.2/-0.30.6±0.30.8±0.31.0±0.3

■PREVIOUS PART NUMBERING

SAMSUNG Multilayer Ceramic Capacitor ●

Type(Size)●

Capacitance Temperature Characteristics ●

Nominal Capacitance ●

Capacitance Tolerance ●

Rated Voltage ●

Thickness Option ●

Packaging Type ●

CAPACITANCE TEMPERATURE CHARACTERISTICS ●

CLASS Ⅰ(TemperatureCompensation) Symbol C P R S T U L

EIA Code C0G(CH)P2H R2H S2H T2H U2J S2L

Temperature

Coefficient(PPM/℃)

0±30-150±60-220±60-330±60-470±60-750±120+350~-1000

※Temperature

Characteristics

C ΔP ΔR ΔS ΔT ΔU ΔSL

Operation

Temperature Range

-55~+125℃

※Temperature Characteristics Temperature

below 2.0pF 2.2~3.9pF above 4.0pF

Characteristics

C ΔP ΔR ΔS ΔT ΔU Δ

C0G -----C0G P2J R2J S2J T2J U2J

C0G P2H R2H S2H

T2H U2J

above 10pF

C0G P2H R2H S2H T2H U2J

☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃

CLASS Ⅱ(HighDielectric Constant)

Symbol A B F

EIA Code X5R X7R Y5V

Capacitance Change

(ΔC :%)

±15±15+22~-82

Operation

Temperature Range

-55~+85℃-55~+125℃-30~+85℃

NOMINAL CAPACITANCE ●

The nominal capacitance value is expressed in pico-Farad(pF)and identified by three-digit number, first two digits represent significant figures and last digit specifies the number of zeros to follow. For values below 1pF, the letter "R" is used as the decimal point and the last digit becomes significant.

example)

100:10×10o =020:2×10o =1R5:1.5pF

10pF 2pF

102:10×

102=1000pF

CAPACITANCE TOLERANCE ●

Temperature Characteristics

Symbol B C

C0G(NPO)

or T.C Series

D F G J K

A(X5R)B(X7R)F(Y5V)

J K M Z

Tolerance ±0.1pF ±0.25pF ±0.5pF ±1pF ±2%±5%±10%±5%±10%±20%-20%~+80%

E-6Series E-12Series

E-24Series for over 10pF Applicable Capacitance &Range

0.5~3pF 0.5~10pF 6~10pF

※Please consult us for special tolerances.

RATED VOLTAGE ●

THICKNESS OPTION ●Symbol N A B C D E

Description of the Code

Standard thickness (pleaserefer to standard thickness table on next page) Thinner than standard thickness Thicker than standard thickness

Standard Thickness High Q (Low `D.F `) Sn-100%(High-Q)Sn-100%(General)

※Please Consult us for other termination type.

PACKAGING TYPE ●STANDARD CAPACITANCE STEP Series E-3E-6E-12E-24

1.01.01.1

1.0

1.21.21.3

1.51.51.61.0

1.5

1.81.82.0

2.22.22.4

2.2

2.72.73.0

3.33.33.6

Capacitance Step

2.2

3.3

3.93.94.3

4.74.75.1

4.7

5.65.66.2

6.86.87.54.7

6.8

8.28.29.1

※Standard Capacitance is " Each step ×10n "

■NEW PART NUMBERING

SAMSUNG Multilayer Ceramic Capacitor ●

Size(mm)●

Capacitance Temperature Characteristic ●

Nominal Capacitance ●

Capacitance Tolerance ●

Rated Voltage ●

Thickness Option ●

Product &Plating Method ●

Samsung Control Code ●

Reserved For Future Use ●

Packaging Type ●

PRODUCT ABBREVIATION ●

Symbol CL

Product Abbreviation

SAMSUNG Multilayer Ceramic Capacitor

SIZE(mm)●

Symbol [**************]5

Size(mm)

Length 0.61.01.62.03.23.24.55.7

Width 0.30.50.81.21.62.53.25.0

CAPACITANCE TEMPERATURE CHARACTERISTIC ●Symbol C P R S T U L A B F

Class ⅡClass Ⅰ

Temperature Characteristics COG P2H R2H S2H T2H U2J S2L X5R X7R Y5V

C △P △R △S △T △U △S △X5R X7R Y5V

0±30(ppm/℃) -150±60-220±60-330±60-470±60-750±60+350~-1000

±15%±15%+22~-82%

-55~+85℃-55~+125℃-30~+85℃-55~+125℃Temperature Range

※Temperature Characteristic

Temperature Characteristics

C ΔP ΔR ΔS ΔT ΔU Δ

Below 2.0pF

C0G -----2.2~3.9pF

C0G P2J R2J S2J T2J U2J

Above 4.0pF

C0G P2H R2H S2H T2H U2J

Above 10pF

C0G P2H R2H S2H T2H U2J

J :±120PPM/℃, H :±60PPM/℃, G :±30PPM/℃

NOMINAL CAPACITANCE ●

Nominal capacitance is identified by 3digits.

The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. 'R' identifies a decimal point. ●Example

Symbol 1R5103104

Nominal Capacitance

1.5pF

10,000pF, 10nF, 0.01μF 100,000pF, 100nF, 0.1μF

CAPACITANCE TOLERANCE ●

Symbol A B C D F F G J K M Z

Tolerance ±0.05pF ±0.1pF ±0.25pF ±0.5pF ±1pF ±1%±2%±5%±10%±20%+80,-20%

More than 10pF Less than 10pF (Including10pF) Nominal Capacitance

RATED

VOLTAGE ●

THICKNESS OPTION ●

Type [1**********]8

Symbol

358A

2012

C F C

3216

F H F H

3225

I J F H

4532

I J L F H

5750

I J L

2.02.51.251.6

±0.20

2.02.53.21.251.6

±0.20

2.02.53.2

±0.30±0.30

Thickness(T)

0.300.500.800.65

±0.10

0.851.250.851.251.61.251.6

±0.20±0.10±0.15±0.15±0.20Spec ±0.03±0.05±0.10

PRODUCT &PLATING METHOD ●Symbol A N G

Electrode

Pd Ni Cu

Termination

Ag Cu Cu

Plating Type Sn_100%Sn_100%Sn_100%

SAMSUNG CONTROL CODE

●

RESERVED FOR FUTURE USE ●

Symbol N

Description of the code Reserved for future use

PACKAGING TYPE

●

CAPACITANCE vs CHIP THICKNESS STANDARD

Description

[1**********]8(0201)(0402)(0603)

0.6±0.030.3±0.030.3±0.03

1.0±0.050.5±0.050.5~±0.050.5~240

1.6±0.10.8±0.10.8±0.1

0.65±0.1

2012Type (0805)

2.0±0.1

3216Type (1206)

3.2±0.15

3.2±0.21.6±0.2

3225Type (1210)

3.2±0.3

4532Type (1812)

4.5±0.4

5750Type (2220)

5.7±0.4

Dimension (mm)

W 1.25±0.10.85±0.1

1.6±0.152.5±0.2

1.251.6±0.2±0.2

2.0±0.2

2.5±0.2

1.25±0.2

3.2±0.31.6±0.2

2.0±0.2

2.5±0.2

5.0±0.41.62.0±0.2±0.2

2.5±0.2

1.250.851.251.6±0.1±0.15±0.15±0.2

SL 50V C R A A P N A

25V G C

E I

T C, TC p A (ExceptF N SL,UJ) C

50V E

0.5~0.5~1600~0.5~3000~6200~

1000~[***********]008200

-----------

0.5~470.5~2200.5~1000

3300~1500~3900~7500~[**************]00

----------

()

0.5~1800.5~10000.5~620~1100~0.5~2400~[***********]0

560~1100024000~

[**************]

1000~24000~62000~[**************]0

[***********]00

6.3V 102202200--10000--100004700~100004700

---22000---47000--47000

10V

A (X5R)

[1**********]0~470-

--2200-----220006800~10000-

------47000

16V -47--1000------------

25V --6.8~1047~10033~10010~334.7~100.22~4.7-220~33010~22010~332.2~10

----------------

50V

C A P A C I T A N C E R A N G E (n F )

6.3V

F (Y5V)

-0.1~100.1~100.1~1-

-470~1000220~470100~22047~1000.22~1002200100~1000100~100022~3302.2~100

------6800~10000

-----------

6.3V -220~27068~20039~680.22~39-

-330~470220~33082~10047~100-

1000560~1000390~1000150~470220

-----22000-------

10V

B (X7R)

1000~47001500~33003900~[1**********]0

----22000---

16V

330~1000~2200~1500~33003900~[***********]0100~470~3306201~150-220

680~1000390~1000-680~180015002.2~680-820~1000-2200

---2200----

25V --10~1000-

-1000---100003300~4700-

50V -10~100-

-------

10000-47000------

10V -10~68010~2202.2~68

-4700-

470010000~

22000

---22000------100000

16V -

820~1200~1000~2700~100003300~[***********][**************]~47082~150

560~1000180~1000

470~1200~2700~1000~4700~[***********]00010~470

560~1000

-100~1000

---22000----

25V -----10000---

50V ------10000---

■PACKAGING

●CARDBOARD PAPER TAPE

Symbol Type

D i m e n s i o n

05102131

W F E P1

2.0±0.05

P2P0D t

0.37±0.030.6±0.05

0.38±0.03

0.68±0.03

0.651.15+0.05/-0.1+0.05/-0.11.1±0.2

1.9±0.22.4±0.23.6±0.2

8.0±0.33.5±0.051.75±0.1

4.0±0.1

2.0±0.054.0±0.1Φ1.5+0.1/-0

1.1MAX

1.6±0.22.0±0.2

●EMBOSSED PLASTIC TAPE

●TAPING SIZE

unit :pcs

Symbol 7" Reel 13" Reel

Cardboard Paper Tape

400015000

Embossed Plastic Tape

2000-

●REEL DIMENSION

unit :mm

Symbol 7" Reel 13" Reel

A φ178±2.0φ330±2.0

B min. φ50min. φ70

φ13±0.5

21±0.8

2.0±0.5

10±1.5

0.8±0.2

1.0

●BULK CASE PACKAGING

-Bulk case packaging can reduce the stock space and transportation costs. -The bulk feeding system can increase the productivity. -It can eliminate the components

loss.

Symbol Dimension Symbol Dimension

A 6.8±0.1F 31.5+0.2/-0

B 8.8±0.1W 36+0/-0.2

T 12±0.1G 19±0.35

C 1.5+0.1/-0

H 7±0.35

D 2+0/-0.1

L 110±0.7

E 4.7±0.1

I 5±0.35

●QUANTITY

Size Quantity *Option

05(0402)50,000

10(0603)10,000~15,000*

21(0805)

T ≤0.85mm 10,000

T ≥1.0mm 5,000

■CHARACTERISTIC MAP

●CLASS Ⅰ

Temperature Characteristics

Size 05(0402)10(0603)

Voltage

0.5

100

240

1000

Capacitance Range (㎊)

10000

100000

[**************]

100000000

50V

50V 1000

SL,UJ

21(0805)31(1206)03(0201)05(0402)

50V

2700

50V

8200

25V 25V 50V 25V 50V 25V 50V 25V 50V 50V 100V 25V 50V 50V

220180

[1**********]0

33001500

100008200

10(0603)

21(0805)

C(COG)&TC Series

31(1206)

4700

560

4700

4700018000

100000

1000

43000

68000

130000

32(1210)

43(1812)55(2220)

●CLASS Ⅱ, A(X5R)

Temperature Characteristics

Size Voltage

100

Capacitance Range (㎊)

1000

10000

100000

[***********]000000

0603(0201)

6.3V 10V 6.3V

1000010000

[1**********]0

47000

6800

10000

[1**********]000

330000

470000

10000000

[1**********]000

10000000

4700000

[**************]

[**************]0

6800000

10000000

[***********]000000

1005(0402)

10V 16V 50V 6.3V

1608(0603)

10V 16V 6.3V

A(X5R)

2012(0805)

10V 16V 6.3V

3216(1206)

10V 16V 6.3V

3225(1210)

10V 16V

4532(1812)5750(2220)

6.3V 6.3V 10V

●CLASS Ⅱ, B(X7R)

Temperature Characteristics

Capacitance Range (㎊)

Size

Voltage

[1**********]0

1000

[***********]0

220

4700

[***********]47000

220

[***********][1**********]00

1000000

[**************]0

220

[***********]00220000

[1**********]000

[***********][***********]000

6.3V

03(0201)

10V 16V 6.3V 10V

05(0402)

16V 25V 50V 6.3V 10V

10(0603)

16V 25V 50V 6.3V 10V

21(0805)

16V 25V 50V 6.3V 10V

31(1206)

16V 25V 50V

1000010000

[1**********]0

33000

10000

B(X7R)

10000000

[***********]0001000000

[1**********]0

1000

●CLASS Ⅱ, B(X7R)

Temperature Characteristics

Capacitance Range (㎊)

Size

Voltage

100

1000

10000

100000

[***********]000000

22000000

[***********]00

2200

[***********]0001000000

22000000

[1**********]000

10000

1000000

10000000

3300000

4700000

6.3V 10V

32(1210)

16V 25V 50V

B(X7R)

43(1812)

10V 16V 25V 50V

55(2220)

25V 50V

●CLASS Ⅱ, F(Y5V)

Temperature Characteristics

Size

03(0201)

Voltage

100

1000

Capacitance Range (㎊)

1000010000

220000

1000010000

2200

3300010000

2200000

[1**********]0

22000

2200

[1**********]0

10000000

4700000

1000010000

2200

[***********]0004700000

[***********][1**********]0

100000

[1**********]0

6.3V 10V

05(0402)

16V 25V 50V 6.3V 10V

[1**********]000

10(0603)

16V 25V 50V 6.3V 10V

21(0805)

16V 25V

F(Y5V)

50V 10V

31(1206)

16V 25V 50V 6.3V 10V

32(1210)

16V 25V 50V 16V

43(1812)

25V 50V

55(2220)

10V

100000

[1**********]000

1000000

[***********]000000

100000000

10000

[**************]0

[1**********]00

[1**********]000

[***********][1**********]000

■RELIABILITY TEST DATA

NO 1

ITEM APPEARANCE

PERFORMANCE

NO ABNORMAL EXTERIOR APPEARANCE 10,000㏁OR 500㏁·㎌PRODUCT WHICHEVER IS

INSULATION RESISTANCE

SMALLER

(RATEDVOLTAGE IS BELOW 16V :10,000㏁OR 100㏁·㎌)

TEST CONDITION

THROUGH MICROSCOPE(×10)

RATED VOLTAGE SHALL BE APPLIED.

MEASUREMENT TIME IS 60~120RATED VOLTAGE TIME 60SEC.

WITHSTANDING

VOLTAGE

NO DIELECTRIC BREAKDOWN OR MECHANICAL BREAKDOWN

CLASS Ⅰ:300%OF THE RATED VOLTAGE FOR 1~5SEC, CLASS Ⅱ:250%OF THE RATED VOLTAGE FOR 1~5SEC IS APPLIED WITH LESS THAN 50㎃CURRENT

CAPACITANCE

CLASS Ⅰ

CAPACIT ANCE

CLASS Ⅱ

WITHIN THE SPECIFIED TOLERANCE

1,000㎊AND BELOW MORE THAN 1,000㎊CAPACITANCE 10㎌AND BELOW MORE THAN

10㎌CAPACITANCE

CLASS Ⅰ

OVER 30㎊:Q ≥1,000

LESS THAN 30㎊:Q ≥400+20C

(C :CAPACITANCE )

1,000㎊AND BELOW MORE THAN 1,000㎊

FREQUENCY 1㎒±10%

VOLTAGE

0.5~5Vrms

1㎑±10%FREQUENCY 1㎑±10%120㎐±20%FREQUENCY 1㎒±10%

0.5~5Vrms

1㎑±10%FREQUENCY 1㎑±10%120㎐±20%

VOLTAGE 1.0±0.2Vrms 0.5±0.1Vrms VOLTAGE 1.0±0.2Vrms 0.5±0.1Vrms VOLTAGE

1. CHAR :B

RATED VOLTAGE

CAPACITANCE

DF SPEC 0.05max 0.05max 0.035max 0.025max 0.025max

10㎌AND BELOW MORE THAN 10㎌

6.3V 10V 16V 25V 50V 이상

2. CHAR :F

Tan δ

CLASS Ⅱ

[***********]2545325750

6.3V -0.16max 0.16max 0.16max 0.16max 0.16max

10V 0.125max 0.125max 0.125max 0.125max 0.125max 0.16max 0.125max

16V 25V 0.05max 0.05max(C≤100nF) 0.07max(C>100nF)

0.07max 0.07max 0.07max(C≤6.8㎌) 0.09max(C>6.8㎌)

50V 0.05max 0.05max 0.05max 0.05max 0.05max

0.09max (C＜220nF) 0.125max (C≥220nF)

0.09max 0.09max 0.09max 0.09max 0.09max

*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED

AFTER THE HEAT TREATMENT OF 150+0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE &ROOM HUMIDITY.

ITEM

APPEARANCE

PERFORMANCE

NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC

CAPACITANCE CHANGE WITHIN ±5%OR

CAPACITANCE

CLASS Ⅰ

±0.5㎊WHICHEVER IS LARGER

CLASS Ⅱ

HUMIDITY

(STEADYSTATE)

CLASS Ⅰ

A,B F

WITHIN ±12.5%WITHIN ±30%

MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR CLASS Ⅰ:24±2Hr. CLASS Ⅱ:48±4Hr.

6.3V Tan δ

6.3V 0.075MAX

4V 0.1MAX

TEST CONDITION

TEMPERATURE TEST TIME

:40±2℃

RELATIVE HUMIDITY:90~95%RH

:500+12/-0Hr.

30㎊AND OVER :Q ≥35010~30㎊

:Q ≥275+2.5×C

LESS THAN 10pF :Q ≥200+10×C

CHAR.

25V AND OVER 0.05

16V

10V 0.05MAX

0.125MAX *Condition1005C ≥0.22㎌1608C ≥2.2㎌2012C ≥4.7㎌3216C ≥10.0㎌3225C ≥22.0㎌4532C ≥47.0㎌5750C ≥100.0㎌

Tan δCLASS Ⅱ

A,B 0.05MAX 0.1MAX (C〈1.0㎌) 0.125MAX (C≥1.0㎌)

CLASS Ⅱ(A,B)

0.075MAX 0.15MAX 0.195MAX 0.25MAX

INSULATION RESISTANCE APPEARANCE

MINIMUM INSULATION RESISTANCE:

1,000㏁OR 50㏁·㎌PRODUCT WHICHEVER IS SMALLER

NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC

CAPACITANCE CHANGE WITHIN ±7.5%OR

CLASS Ⅰ

±0.75㎊WHICHEVER IS LARGER

A,B

WITHIN ±12.5%WITHIN ±30%WITHIN +30~－40%

CLASS

Ⅱ

1005C>0.47μF 1608C>1.0μF 2012C>4.7μF 3216C>10.0μF 3225C>22.0μF 4532C>47.0μF

APPLIED VOLTAGE :

RATED VOLTAGE

TEMPERATURE :40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME :500+12/-0Hr. CURRENT APPLIED :50㎃MAX.

CLASS ⅡSHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

CLASS ⅠSHOULD BE MEASURED AFTER LEFT FOR 24±2HRS IN ROOM TEMPERATURE AND HUMIDITY. CLASS ⅡSHOULD BE MEASURED LATTER VALUE AFTER BE

HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

CAPACITANCE

MOISTURE

RESISTANCE

Q CLASS Ⅰ

30㎊AND OVER :Q ≥200

30㎊AND BELOW :Q ≥100+10/3×C

CHAR.

25V AND OVER 0.05MAX

16V

10V

6.3V

6.3V Tan δ0.125MAX *Condition1005C ≥0.22㎌

Tan δCLASS Ⅱ

A,B

0.05MAX 0.1MAX (C〈1.0㎌) 0.125MAX (C≥1.0㎌)

0.05MAX 0.075MAX 0.1MAX

CLASS Ⅱ(A,B)

1608C ≥2.2㎌2012C ≥4.7㎌3216C ≥10.0㎌3225C ≥22.0㎌4532C ≥47.0㎌5750C ≥100.0㎌

0.075MAX 0.15MAX 0.195MAX 0.25MAX

INSULATION RESISTANCE

MINIMUM INSULATION RESISTANCE:500㏁OR 25㏁·㎌PRODUCT, WHICHEVER IS SMALLER.

ITEM

PERFORMANCE

TEST CONDITION

APPLIED VOLTAGE :

150%,200%OF RATED VOLTAGE TEST TIME :1000+48/-0Hr. CURRENT APPLIED :50㎃MAX.

APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR

CHAR.

CHARACTERISTIC

CLASS Ⅰ

A,B

CAP. CHANGE

WITHIN ±3%OR ±0.3㎊, WHICHEVER IS LARGER WITHIN ±12.5%WITHIN ±30%

CAPACITANCE

CLASS Ⅱ

HIGH

TEMPERATURE RESISTANCE

Q CLASS Ⅰ

10~30㎊

WITHIN+30~40%1005C>0.47μF 1608C>1.0μF 2012C>4.7μF 3216C>10.0μF 3225C>22.0μF 4532C>47.0μF

30㎊AND OVER :Q ≥350

:Q ≥275+2.5×C

LESS THAN 10㎊:Q≥200+10×C CHAR.

AND OVER

TEMP. 125±3℃

85±3℃125±3℃85±3℃

CLASS ⅠCLASS Ⅱ

B F

CLASS ⅡSHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

CLASS ⅠSHOULD BE MEASURED AFTER LEFT FOR 24±2HRS IN ROOM TEMPERATURE AND HUMIDITY.

CLASS ⅡSHOULD BE MEASURED LATTER VALUE AFTER BE HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

*150%Authorization

Conditions

25V

16V 0.05MAX

0.1MAX (C

10V 0.05MAX

6.3V 0.075MAX

4V 0.1MAX

1005C>0.47μF 1608C ≥2.2㎌

CLASS Ⅱ(A,B,F)

2012C ≥4.7㎌3216C ≥10.0㎌3225C ≥22.0㎌4532C ≥47.0㎌5750C ≥100.0㎌

Tan δCLASS Ⅱ

A,B

0.05MAX

0.075MAX 0.15MAX 0.195MAX 0.25MAX

(TWICEOF RATED VOLTAGE WILL BE

INSULATION RESISTANCE

MINIMUM INSULATION RESISTANCE:1,000㏁OR 50㏁·㎌PRODUCT WHICHEVER IS SMALLER

NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC

CAP. CHANGE

WITHIN ±2.5%

APPLIED TO ALL SERIES BUT ABOVE) **HOWEVER, SEE (FIG.3)

A/B는1005C ≥0.22㎌

APPEARANCE

CAPACITORS SHALL BE SUBJECTED TO FIVE CYCLES OF THE

TEMPERATURE CYCLE AS FOLLOWING STEP 1234

TEMP.(℃) MIN.RATED TEMP.+0/-3

25MAX.RATED TEMP.+3/-0

TIME(MIN)

302~3302~3

CAPACITANCE

CLASS ⅠOR ±0.25㎊WHICHEVER IS LARGER

CLASS

TEMPERATURE

CYCLE

Q CLASS ⅠTan δCLASS ⅡINSULATION RESISTANCE

Ⅱ

A,B F

WITHIN ±7.5%WITHIN ±20%

30㎊AND OVER :Q ≥1000LESS THAN 30㎊:Q≥400+20×C TO SATISFY THE SPECIFIED INITIAL VALUE

TO SATISFY THE SPECIFIED INITIAL VALUE

MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR CLASS Ⅰ:24±2Hr. CLASS Ⅱ:48±4Hr.

■CHARACTERISTIC GRAPH

●ELECTRICAL CHARACTERISTICS

CAPACITANCE -TEMPERATURE CHARACTERISTICS

CAPACITANCE -DC VOLTAGE CHARACTERISTICS CAPACITANCE CHANGE -

AGING

■APPLICATION MANUAL

●Storage Condition

Storage Environment

The electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity of less than 40℃and 70%,respectively. Guaranteed storage period is within 6months from the outgoing date of delivery.

Corrosive Gases

Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.

Temperature Fluctuations

Since dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage, it is important to maintain the temperature-controlled environment.

●Design of Land Pattern

When designing printed circuit boards, the shape and size of the lands must allow for the

proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently. Use the following illustrations as guidelines for proper land design. Recommendation of Land Shape and Size

●Adhesives

When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. Requirements for Adhesives

They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board.

They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly.

They should not corrode the circuit board or chip material.

They should be a good insulator.

They should be non-toxic, and not produce harmful gases, nor be harmful when touched. Application Method

It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor adhesion and overflow into the land, respectively.

Adhesive hardening Characteristics

To prevent oxidation of the terminations, the adhesive must harden at 160℃or less, within 2minutes or less.

●Mounting

Mounting Head Pressure

Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during mounting.

Bending Stress

When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the board. When the MLCCs are mounted onto the other side, it is important to support the board as shown in the illustration. If the circuit board is not supported, the crack occur to the ready-installed MLCCs by the bending stress.

●Flux

Although the solderability increased by the highly-activated flux, increase of activity in flux may also degrade the insulation of the chip capacitors. To avoid such degradation, it is recommended that a mildly activated rosin flux(lessthan 0.2%chlorine) be used.

●Soldering

Since a multilayer ceramic chip capacitor comes into direct contact with melted solder during soldering, it is exposed to potentially mechanical stress caused by the sudden temperature change. The capacitor may also be subject to silver migration, and to contamination by the flux. Because of these factors, soldering technique is critical. Soldering Methods

Method

-Overall heating

Reflow soldering

-Local heating

Flow soldering

-Single wave -Double wave

Classification

-Infrared rays -Hot plate

-VPS(vaporphase) -Air heater -Laser

-Light beam

*We recommend the reflow soldering method.

Soldering Profile

To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent

graph.

℃

[**************]50

℃

300250200

15010050

60~120sec3~4sec

Reflow Soldering Flow Soldering

Manual Soldering

Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot

soldering iron tip comes into direct contact with the end terminations, and operator's carelessness

may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip.

Amount of

Solder

Cooling

Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference(△T) must be less than 100℃6-6. Cleaning

If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new.

Notes for Separating Multiple, Shared PC Boards.

A multi-PC board is separated into many individual circuit boards after soldering has been

completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board.

■CROSS REFERENCE

P/N

①COMPANY

COMPANY

MODEL(MLCC)

0201(0603)0402(1005)0603(1608)0805(2012)

②SIZE (EIA/JIS)

1206(3216)1210(3225)1808(4520)1812(4532)2220(5750)

SAMSUNG

CL [***********]

AVX --[***********]1018081812-

JOHANSON

--R07R14R15R18S41R29S43-

KEMET C -[***********][1**********]220

KYOCERA

CM [***********]55

MURATA GRM 3336394042-642-2-43-244-1

NOVACAP

--[***********][1**********]221

PANASONIC

ECJ Z 01234---

ROHM MCH -1518213132-43-

TAIYO -YUDEN MK [***********]-432550

TDK C [***********][***********]

VITRAMON

VJ -[***********]1018081812-

COG(NPO)C A N G CG COG/CHN C A C COG/CHA

P2H(N150)R2H(N220)S2H(N330)

③

TEMPERATURE CHARACTERISTIC

U2J(N750)

S2L X7R Z5U T2H(N470)

P R S T U L B E

S 13O Z Y C E

------W Z

------R(X)U

P R S T U SL X7R -

P2H R2H S2H T2H U2J SL X7R Z5U

------B Z

P R S T U G B -

----UJ SL C E

P R S T U SL BJ -

PH RH SH TH UJ SL X7R(B)Z5U

------Y(X)U

Y5V F G Y V Y5V Y5V Y F F F Y5V -

④NOMINAL CAPACITANCE ⑤CAPACITANCE TOLERANCE

6.3V 10V 16V 25V 50V 100V 200V 250V 500V 630V 1000V 2000V 3000V 4000V NICKEL BARRIER

⑦TERMINATION

Ag/PdBULK(VINYL)PAPER TAPING

⑧PACKAGE

PLASTIC TAPING BULK CASE

E P

1, 37

E, U -P B C

192, 4

-(NONE)T, R

Q P O A B C D E G H I J K -N

6Z Y 3512V 7-A G H J T

V B:±0.1㎊

-[***********]-501-102202302

EX) 103=10,000㎊C:±0.25㎊

9843512-------C -----D:±0.5㎊

[***********][***********]04000A B B T, L H, N C

221=220㎊

F:±1%

6.[***********]5006301K 2K 3K -(GRM)(GR)PB PT PT PC

225=2,200,000㎊=2.2㎌G:±2%

--[***********]501-[1**********]2N P *T --J:±5%

1R5=1.5㎊K:±10%0J 1A 1C 1E 1H 2A 2D ---------X E,V,W F, Y C

010=1㎊

Z:-20~+80%

J L E T U -----------B T T -0J 1A 1C 1E 1H 2A -2E -2J 3A 3D 3F ---B T ----J X A B C -E -G -H -X F B C, P T, R G

M:±20%

-43251--------(MCH)(MC)-K, L P, Q C

⑥RATED VOLTAGE

SAMSUNG :CL10B104KA8NNNC

AVX :06033C104KAT2A

JOHANSON :250R14W104KV6T

KEMET :C0603C104K3RAC

KYOCERA :CM105X7R104K25AT

MURATA :GRM188R71E104KA01D

NOVACAP :0603B104K250N_TM

PANASONIC :ECJ1EB1E104K

ROHM :MCH182C104KKN

TAIYO-YUDEN :TMK107BJ104K_T

TDK :C1608X7R1E104KT

VITRAMON :VJ0603Y104KXXMC

■INTRODUCTION

■FEATURE AND APPLICATION

●Feature -Miniature Size

-Wide Capacitance and Voltage Range -Highly Reliable Performance

-Tape &Reel for Surface Mount Assembly -Low ESR

-High Q at High Frequencies

-Stable Temperature Dependence of Capacitance ●Application

-High Frequency Circuit(Tuner,VCO, PAM etc) -General Power Supply Circuit(SMPSetc) -DC-DC Converter

-General Electronic Circuit

■

STRUCTURE

■APPEARANCE AND DIMENSION

CODE [**************]5

EIA CODE

[***********][1**********]220

0.6±0.031.0±0.051.6±0.12.0±0.13.2±0.23.2±0.34.5±0.45.7±0.4

DIMENSION (mm ) W 0.3±0.030.5±0.050.8±0.11.25±0.11.6±0.22.5±0.23.2±0.35.0±0.4

T (MAX)0.3±0.030.5±0.050.8±0.11.25±0.11.6±0.22.5±0.23.2±0.33.2±0.3

BW 0.15±0.050.2+0.15/-0.10.3±0.20.5+0.2/-0.30.5+0.2/-0.30.6±0.30.8±0.31.0±0.3

■PREVIOUS PART NUMBERING

SAMSUNG Multilayer Ceramic Capacitor ●

Type(Size)●

Capacitance Temperature Characteristics ●

Nominal Capacitance ●

Capacitance Tolerance ●

Rated Voltage ●

Thickness Option ●

Packaging Type ●

CAPACITANCE TEMPERATURE CHARACTERISTICS ●

CLASS Ⅰ(TemperatureCompensation) Symbol C P R S T U L

EIA Code C0G(CH)P2H R2H S2H T2H U2J S2L

Temperature

Coefficient(PPM/℃)

0±30-150±60-220±60-330±60-470±60-750±120+350~-1000

※Temperature

Characteristics

C ΔP ΔR ΔS ΔT ΔU ΔSL

Operation

Temperature Range

-55~+125℃

※Temperature Characteristics Temperature

below 2.0pF 2.2~3.9pF above 4.0pF

Characteristics

C ΔP ΔR ΔS ΔT ΔU Δ

C0G -----C0G P2J R2J S2J T2J U2J

C0G P2H R2H S2H

T2H U2J

above 10pF

C0G P2H R2H S2H T2H U2J

☞K :±250PPM/℃J :±120PPM/℃H :±60PPM/℃G :±30PPM/℃

CLASS Ⅱ(HighDielectric Constant)

Symbol A B F

EIA Code X5R X7R Y5V

Capacitance Change

(ΔC :%)

±15±15+22~-82

Operation

Temperature Range

-55~+85℃-55~+125℃-30~+85℃

NOMINAL CAPACITANCE ●

example)

100:10×10o =020:2×10o =1R5:1.5pF

10pF 2pF

102:10×

102=1000pF

CAPACITANCE TOLERANCE ●

Temperature Characteristics

Symbol B C

C0G(NPO)

or T.C Series

D F G J K

A(X5R)B(X7R)F(Y5V)

J K M Z

Tolerance ±0.1pF ±0.25pF ±0.5pF ±1pF ±2%±5%±10%±5%±10%±20%-20%~+80%

E-6Series E-12Series

E-24Series for over 10pF Applicable Capacitance &Range

0.5~3pF 0.5~10pF 6~10pF

※Please consult us for special tolerances.

RATED VOLTAGE ●

THICKNESS OPTION ●Symbol N A B C D E

Description of the Code

Standard thickness (pleaserefer to standard thickness table on next page) Thinner than standard thickness Thicker than standard thickness

Standard Thickness High Q (Low `D.F `) Sn-100%(High-Q)Sn-100%(General)

※Please Consult us for other termination type.

PACKAGING TYPE ●STANDARD CAPACITANCE STEP Series E-3E-6E-12E-24

1.01.01.1

1.0

1.21.21.3

1.51.51.61.0

1.5

1.81.82.0

2.22.22.4

2.2

2.72.73.0

3.33.33.6

Capacitance Step

2.2

3.3

3.93.94.3

4.74.75.1

4.7

5.65.66.2

6.86.87.54.7

6.8

8.28.29.1

※Standard Capacitance is " Each step ×10n "

■NEW PART NUMBERING

SAMSUNG Multilayer Ceramic Capacitor ●

Size(mm)●

Capacitance Temperature Characteristic ●

Nominal Capacitance ●

Capacitance Tolerance ●

Rated Voltage ●

Thickness Option ●

Product &Plating Method ●

Samsung Control Code ●

Reserved For Future Use ●

Packaging Type ●

PRODUCT ABBREVIATION ●

Symbol CL

Product Abbreviation

SAMSUNG Multilayer Ceramic Capacitor

SIZE(mm)●

Symbol [**************]5

Size(mm)

Length 0.61.01.62.03.23.24.55.7

Width 0.30.50.81.21.62.53.25.0

CAPACITANCE TEMPERATURE CHARACTERISTIC ●Symbol C P R S T U L A B F

Class ⅡClass Ⅰ

Temperature Characteristics COG P2H R2H S2H T2H U2J S2L X5R X7R Y5V

C △P △R △S △T △U △S △X5R X7R Y5V

0±30(ppm/℃) -150±60-220±60-330±60-470±60-750±60+350~-1000

±15%±15%+22~-82%

-55~+85℃-55~+125℃-30~+85℃-55~+125℃Temperature Range

※Temperature Characteristic

Temperature Characteristics

C ΔP ΔR ΔS ΔT ΔU Δ

Below 2.0pF

C0G -----2.2~3.9pF

C0G P2J R2J S2J T2J U2J

Above 4.0pF

C0G P2H R2H S2H T2H U2J

Above 10pF

C0G P2H R2H S2H T2H U2J

J :±120PPM/℃, H :±60PPM/℃, G :±30PPM/℃

NOMINAL CAPACITANCE ●

Nominal capacitance is identified by 3digits.

The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. 'R' identifies a decimal point. ●Example

Symbol 1R5103104

Nominal Capacitance

1.5pF

10,000pF, 10nF, 0.01μF 100,000pF, 100nF, 0.1μF

CAPACITANCE TOLERANCE ●

Symbol A B C D F F G J K M Z

Tolerance ±0.05pF ±0.1pF ±0.25pF ±0.5pF ±1pF ±1%±2%±5%±10%±20%+80,-20%

More than 10pF Less than 10pF (Including10pF) Nominal Capacitance

RATED

VOLTAGE ●

THICKNESS OPTION ●

Type [1**********]8

Symbol

358A

2012

C F C

3216

F H F H

3225

I J F H

4532

I J L F H

5750

I J L

2.02.51.251.6

±0.20

2.02.53.21.251.6

±0.20

2.02.53.2

±0.30±0.30

Thickness(T)

0.300.500.800.65

±0.10

0.851.250.851.251.61.251.6

±0.20±0.10±0.15±0.15±0.20Spec ±0.03±0.05±0.10

PRODUCT &PLATING METHOD ●Symbol A N G

Electrode

Pd Ni Cu

Termination

Ag Cu Cu

Plating Type Sn_100%Sn_100%Sn_100%

SAMSUNG CONTROL CODE

●

RESERVED FOR FUTURE USE ●

Symbol N

Description of the code Reserved for future use

PACKAGING TYPE

●

CAPACITANCE vs CHIP THICKNESS STANDARD

Description

[1**********]8(0201)(0402)(0603)

0.6±0.030.3±0.030.3±0.03

1.0±0.050.5±0.050.5~±0.050.5~240

1.6±0.10.8±0.10.8±0.1

0.65±0.1

2012Type (0805)

2.0±0.1

3216Type (1206)

3.2±0.15

3.2±0.21.6±0.2

3225Type (1210)

3.2±0.3

4532Type (1812)

4.5±0.4

5750Type (2220)

5.7±0.4

Dimension (mm)

W 1.25±0.10.85±0.1

1.6±0.152.5±0.2

1.251.6±0.2±0.2

2.0±0.2

2.5±0.2

1.25±0.2

3.2±0.31.6±0.2

2.0±0.2

2.5±0.2

5.0±0.41.62.0±0.2±0.2

2.5±0.2

1.250.851.251.6±0.1±0.15±0.15±0.2

SL 50V C R A A P N A

25V G C

E I

T C, TC p A (ExceptF N SL,UJ) C

50V E

0.5~0.5~1600~0.5~3000~6200~

1000~[***********]008200

-----------

0.5~470.5~2200.5~1000

3300~1500~3900~7500~[**************]00

----------

()

0.5~1800.5~10000.5~620~1100~0.5~2400~[***********]0

560~1100024000~

[**************]

1000~24000~62000~[**************]0

[***********]00

6.3V 102202200--10000--100004700~100004700

---22000---47000--47000

10V

A (X5R)

[1**********]0~470-

--2200-----220006800~10000-

------47000

16V -47--1000------------

25V --6.8~1047~10033~10010~334.7~100.22~4.7-220~33010~22010~332.2~10

----------------

50V

C A P A C I T A N C E R A N G E (n F )

6.3V

F (Y5V)

-0.1~100.1~100.1~1-

-470~1000220~470100~22047~1000.22~1002200100~1000100~100022~3302.2~100

------6800~10000

-----------

6.3V -220~27068~20039~680.22~39-

-330~470220~33082~10047~100-

1000560~1000390~1000150~470220

-----22000-------

10V

B (X7R)

1000~47001500~33003900~[1**********]0

----22000---

16V

330~1000~2200~1500~33003900~[***********]0100~470~3306201~150-220

680~1000390~1000-680~180015002.2~680-820~1000-2200

---2200----

25V --10~1000-

-1000---100003300~4700-

50V -10~100-

-------

10000-47000------

10V -10~68010~2202.2~68

-4700-

470010000~

22000

---22000------100000

16V -

820~1200~1000~2700~100003300~[***********][**************]~47082~150

560~1000180~1000

470~1200~2700~1000~4700~[***********]00010~470

560~1000

-100~1000

---22000----

25V -----10000---

50V ------10000---

■PACKAGING

●CARDBOARD PAPER TAPE

Symbol Type

D i m e n s i o n

05102131

W F E P1

2.0±0.05

P2P0D t

0.37±0.030.6±0.05

0.38±0.03

0.68±0.03

0.651.15+0.05/-0.1+0.05/-0.11.1±0.2

1.9±0.22.4±0.23.6±0.2

8.0±0.33.5±0.051.75±0.1

4.0±0.1

2.0±0.054.0±0.1Φ1.5+0.1/-0

1.1MAX

1.6±0.22.0±0.2

●EMBOSSED PLASTIC TAPE

●TAPING SIZE

unit :pcs

Symbol 7" Reel 13" Reel

Cardboard Paper Tape

400015000

Embossed Plastic Tape

2000-

●REEL DIMENSION

unit :mm

Symbol 7" Reel 13" Reel

A φ178±2.0φ330±2.0

B min. φ50min. φ70

φ13±0.5

21±0.8

2.0±0.5

10±1.5

0.8±0.2

1.0

●BULK CASE PACKAGING

-Bulk case packaging can reduce the stock space and transportation costs. -The bulk feeding system can increase the productivity. -It can eliminate the components

loss.

Symbol Dimension Symbol Dimension

A 6.8±0.1F 31.5+0.2/-0

B 8.8±0.1W 36+0/-0.2

T 12±0.1G 19±0.35

C 1.5+0.1/-0

H 7±0.35

D 2+0/-0.1

L 110±0.7

E 4.7±0.1

I 5±0.35

●QUANTITY

Size Quantity *Option

05(0402)50,000

10(0603)10,000~15,000*

21(0805)

T ≤0.85mm 10,000

T ≥1.0mm 5,000

■CHARACTERISTIC MAP

●CLASS Ⅰ

Temperature Characteristics

Size 05(0402)10(0603)

Voltage

0.5

100

240

1000

Capacitance Range (㎊)

10000

100000

[**************]

100000000

50V

50V 1000

SL,UJ

21(0805)31(1206)03(0201)05(0402)

50V

2700

50V

8200

25V 25V 50V 25V 50V 25V 50V 25V 50V 50V 100V 25V 50V 50V

220180

[1**********]0

33001500

100008200

10(0603)

21(0805)

C(COG)&TC Series

31(1206)

4700

560

4700

4700018000

100000

1000

43000

68000

130000

32(1210)

43(1812)55(2220)

●CLASS Ⅱ, A(X5R)

Temperature Characteristics

Size Voltage

100

Capacitance Range (㎊)

1000

10000

100000

[***********]000000

0603(0201)

6.3V 10V 6.3V

1000010000

[1**********]0

47000

6800

10000

[1**********]000

330000

470000

10000000

[1**********]000

10000000

4700000

[**************]

[**************]0

6800000

10000000

[***********]000000

1005(0402)

10V 16V 50V 6.3V

1608(0603)

10V 16V 6.3V

A(X5R)

2012(0805)

10V 16V 6.3V

3216(1206)

10V 16V 6.3V

3225(1210)

10V 16V

4532(1812)5750(2220)

6.3V 6.3V 10V

●CLASS Ⅱ, B(X7R)

Temperature Characteristics

Capacitance Range (㎊)

Size

Voltage

[1**********]0

1000

[***********]0

220

4700

[***********]47000

220

[***********][1**********]00

1000000

[**************]0

220

[***********]00220000

[1**********]000

[***********][***********]000

6.3V

03(0201)

10V 16V 6.3V 10V

05(0402)

16V 25V 50V 6.3V 10V

10(0603)

16V 25V 50V 6.3V 10V

21(0805)

16V 25V 50V 6.3V 10V

31(1206)

16V 25V 50V

1000010000

[1**********]0

33000

10000

B(X7R)

10000000

[***********]0001000000

[1**********]0

1000

●CLASS Ⅱ, B(X7R)

Temperature Characteristics

Capacitance Range (㎊)

Size

Voltage

100

1000

10000

100000

[***********]000000

22000000

[***********]00

2200

[***********]0001000000

22000000

[1**********]000

10000

1000000

10000000

3300000

4700000

6.3V 10V

32(1210)

16V 25V 50V

B(X7R)

43(1812)

10V 16V 25V 50V

55(2220)

25V 50V

●CLASS Ⅱ, F(Y5V)

Temperature Characteristics

Size

03(0201)

Voltage

100

1000

Capacitance Range (㎊)

1000010000

220000

1000010000

2200

3300010000

2200000

[1**********]0

22000

2200

[1**********]0

10000000

4700000

1000010000

2200

[***********]0004700000

[***********][1**********]0

100000

[1**********]0

6.3V 10V

05(0402)

16V 25V 50V 6.3V 10V

[1**********]000

10(0603)

16V 25V 50V 6.3V 10V

21(0805)

16V 25V

F(Y5V)

50V 10V

31(1206)

16V 25V 50V 6.3V 10V

32(1210)

16V 25V 50V 16V

43(1812)

25V 50V

55(2220)

10V

100000

[1**********]000

1000000

[***********]000000

100000000

10000

[**************]0

[1**********]00

[1**********]000

[***********][1**********]000

■RELIABILITY TEST DATA

NO 1

ITEM APPEARANCE

PERFORMANCE

NO ABNORMAL EXTERIOR APPEARANCE 10,000㏁OR 500㏁·㎌PRODUCT WHICHEVER IS

INSULATION RESISTANCE

SMALLER

(RATEDVOLTAGE IS BELOW 16V :10,000㏁OR 100㏁·㎌)

TEST CONDITION

THROUGH MICROSCOPE(×10)

RATED VOLTAGE SHALL BE APPLIED.

MEASUREMENT TIME IS 60~120RATED VOLTAGE TIME 60SEC.

WITHSTANDING

VOLTAGE

NO DIELECTRIC BREAKDOWN OR MECHANICAL BREAKDOWN

CLASS Ⅰ:300%OF THE RATED VOLTAGE FOR 1~5SEC, CLASS Ⅱ:250%OF THE RATED VOLTAGE FOR 1~5SEC IS APPLIED WITH LESS THAN 50㎃CURRENT

CAPACITANCE

CLASS Ⅰ

CAPACIT ANCE

CLASS Ⅱ

WITHIN THE SPECIFIED TOLERANCE

1,000㎊AND BELOW MORE THAN 1,000㎊CAPACITANCE 10㎌AND BELOW MORE THAN

10㎌CAPACITANCE

CLASS Ⅰ

OVER 30㎊:Q ≥1,000

LESS THAN 30㎊:Q ≥400+20C

(C :CAPACITANCE )

1,000㎊AND BELOW MORE THAN 1,000㎊

FREQUENCY 1㎒±10%

VOLTAGE

0.5~5Vrms

1㎑±10%FREQUENCY 1㎑±10%120㎐±20%FREQUENCY 1㎒±10%

0.5~5Vrms

1㎑±10%FREQUENCY 1㎑±10%120㎐±20%

VOLTAGE 1.0±0.2Vrms 0.5±0.1Vrms VOLTAGE 1.0±0.2Vrms 0.5±0.1Vrms VOLTAGE

1. CHAR :B

RATED VOLTAGE

CAPACITANCE

DF SPEC 0.05max 0.05max 0.035max 0.025max 0.025max

10㎌AND BELOW MORE THAN 10㎌

6.3V 10V 16V 25V 50V 이상

2. CHAR :F

Tan δ

CLASS Ⅱ

[***********]2545325750

6.3V -0.16max 0.16max 0.16max 0.16max 0.16max

10V 0.125max 0.125max 0.125max 0.125max 0.125max 0.16max 0.125max

16V 25V 0.05max 0.05max(C≤100nF) 0.07max(C>100nF)

0.07max 0.07max 0.07max(C≤6.8㎌) 0.09max(C>6.8㎌)

50V 0.05max 0.05max 0.05max 0.05max 0.05max

0.09max (C＜220nF) 0.125max (C≥220nF)

0.09max 0.09max 0.09max 0.09max 0.09max

*THE INITIAL VALUE OF HIGH DIELECTRIC CONSTANT SERIES SHALL BE MEASURED

AFTER THE HEAT TREATMENT OF 150+0/-10℃, 1Hr AND SITTING OF 48±4hr AT ROOM TEMPERATURE &ROOM HUMIDITY.

ITEM

APPEARANCE

PERFORMANCE

NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC

CAPACITANCE CHANGE WITHIN ±5%OR

CAPACITANCE

CLASS Ⅰ

±0.5㎊WHICHEVER IS LARGER

CLASS Ⅱ

HUMIDITY

(STEADYSTATE)

CLASS Ⅰ

A,B F

WITHIN ±12.5%WITHIN ±30%

MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR CLASS Ⅰ:24±2Hr. CLASS Ⅱ:48±4Hr.

6.3V Tan δ

6.3V 0.075MAX

4V 0.1MAX

TEST CONDITION

TEMPERATURE TEST TIME

:40±2℃

RELATIVE HUMIDITY:90~95%RH

:500+12/-0Hr.

30㎊AND OVER :Q ≥35010~30㎊

:Q ≥275+2.5×C

LESS THAN 10pF :Q ≥200+10×C

CHAR.

25V AND OVER 0.05

16V

10V 0.05MAX

0.125MAX *Condition1005C ≥0.22㎌1608C ≥2.2㎌2012C ≥4.7㎌3216C ≥10.0㎌3225C ≥22.0㎌4532C ≥47.0㎌5750C ≥100.0㎌

Tan δCLASS Ⅱ

A,B 0.05MAX 0.1MAX (C〈1.0㎌) 0.125MAX (C≥1.0㎌)

CLASS Ⅱ(A,B)

0.075MAX 0.15MAX 0.195MAX 0.25MAX

INSULATION RESISTANCE APPEARANCE

MINIMUM INSULATION RESISTANCE:

1,000㏁OR 50㏁·㎌PRODUCT WHICHEVER IS SMALLER

NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC

CAPACITANCE CHANGE WITHIN ±7.5%OR

CLASS Ⅰ

±0.75㎊WHICHEVER IS LARGER

A,B

WITHIN ±12.5%WITHIN ±30%WITHIN +30~－40%

CLASS

Ⅱ

1005C>0.47μF 1608C>1.0μF 2012C>4.7μF 3216C>10.0μF 3225C>22.0μF 4532C>47.0μF

APPLIED VOLTAGE :

RATED VOLTAGE

TEMPERATURE :40±2℃RELATIVE HUMIDITY:90~95%RHTEST TIME :500+12/-0Hr. CURRENT APPLIED :50㎃MAX.

CLASS ⅡSHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

CLASS ⅠSHOULD BE MEASURED AFTER LEFT FOR 24±2HRS IN ROOM TEMPERATURE AND HUMIDITY. CLASS ⅡSHOULD BE MEASURED LATTER VALUE AFTER BE

HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

CAPACITANCE

MOISTURE

RESISTANCE

Q CLASS Ⅰ

30㎊AND OVER :Q ≥200

30㎊AND BELOW :Q ≥100+10/3×C

CHAR.

25V AND OVER 0.05MAX

16V

10V

6.3V

6.3V Tan δ0.125MAX *Condition1005C ≥0.22㎌

Tan δCLASS Ⅱ

A,B

0.05MAX 0.1MAX (C〈1.0㎌) 0.125MAX (C≥1.0㎌)

0.05MAX 0.075MAX 0.1MAX

CLASS Ⅱ(A,B)

1608C ≥2.2㎌2012C ≥4.7㎌3216C ≥10.0㎌3225C ≥22.0㎌4532C ≥47.0㎌5750C ≥100.0㎌

0.075MAX 0.15MAX 0.195MAX 0.25MAX

INSULATION RESISTANCE

MINIMUM INSULATION RESISTANCE:500㏁OR 25㏁·㎌PRODUCT, WHICHEVER IS SMALLER.

ITEM

PERFORMANCE

TEST CONDITION

APPLIED VOLTAGE :

150%,200%OF RATED VOLTAGE TEST TIME :1000+48/-0Hr. CURRENT APPLIED :50㎃MAX.

APPEARANCE NO MECHANICAL DAMAGE SHALL OCCUR

CHAR.

CHARACTERISTIC

CLASS Ⅰ

A,B

CAP. CHANGE

WITHIN ±3%OR ±0.3㎊, WHICHEVER IS LARGER WITHIN ±12.5%WITHIN ±30%

CAPACITANCE

CLASS Ⅱ

HIGH

TEMPERATURE RESISTANCE

Q CLASS Ⅰ

10~30㎊

WITHIN+30~40%1005C>0.47μF 1608C>1.0μF 2012C>4.7μF 3216C>10.0μF 3225C>22.0μF 4532C>47.0μF

30㎊AND OVER :Q ≥350

:Q ≥275+2.5×C

LESS THAN 10㎊:Q≥200+10×C CHAR.

AND OVER

TEMP. 125±3℃

85±3℃125±3℃85±3℃

CLASS ⅠCLASS Ⅱ

B F

CLASS ⅡSHOULD BE MEASURED INITIAL VALUE AFTER BE HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

CLASS ⅠSHOULD BE MEASURED AFTER LEFT FOR 24±2HRS IN ROOM TEMPERATURE AND HUMIDITY.

CLASS ⅡSHOULD BE MEASURED LATTER VALUE AFTER BE HEAT-TREATED FOR 1HR IN 150℃+0/-10℃AND BE LEFT FOR 48±4HR AT ROOM TEMPERATURE.

*150%Authorization

Conditions

25V

16V 0.05MAX

0.1MAX (C

10V 0.05MAX

6.3V 0.075MAX

4V 0.1MAX

1005C>0.47μF 1608C ≥2.2㎌

CLASS Ⅱ(A,B,F)

2012C ≥4.7㎌3216C ≥10.0㎌3225C ≥22.0㎌4532C ≥47.0㎌5750C ≥100.0㎌

Tan δCLASS Ⅱ

A,B

0.05MAX

0.075MAX 0.15MAX 0.195MAX 0.25MAX

(TWICEOF RATED VOLTAGE WILL BE

INSULATION RESISTANCE

MINIMUM INSULATION RESISTANCE:1,000㏁OR 50㏁·㎌PRODUCT WHICHEVER IS SMALLER

NO MECHANICAL DAMAGE SHALL OCCUR CHARACTERISTIC

CAP. CHANGE

WITHIN ±2.5%

APPLIED TO ALL SERIES BUT ABOVE) **HOWEVER, SEE (FIG.3)

A/B는1005C ≥0.22㎌

APPEARANCE

CAPACITORS SHALL BE SUBJECTED TO FIVE CYCLES OF THE

TEMPERATURE CYCLE AS FOLLOWING STEP 1234

TEMP.(℃) MIN.RATED TEMP.+0/-3

25MAX.RATED TEMP.+3/-0

TIME(MIN)

302~3302~3

CAPACITANCE

CLASS ⅠOR ±0.25㎊WHICHEVER IS LARGER

CLASS

TEMPERATURE

CYCLE

Q CLASS ⅠTan δCLASS ⅡINSULATION RESISTANCE

Ⅱ

A,B F

WITHIN ±7.5%WITHIN ±20%

30㎊AND OVER :Q ≥1000LESS THAN 30㎊:Q≥400+20×C TO SATISFY THE SPECIFIED INITIAL VALUE

TO SATISFY THE SPECIFIED INITIAL VALUE

MEASURE AT ROOM TEMPERATURE AFTER COOLING FOR CLASS Ⅰ:24±2Hr. CLASS Ⅱ:48±4Hr.

■CHARACTERISTIC GRAPH

●ELECTRICAL CHARACTERISTICS

CAPACITANCE -TEMPERATURE CHARACTERISTICS

CAPACITANCE -DC VOLTAGE CHARACTERISTICS CAPACITANCE CHANGE -

AGING

■APPLICATION MANUAL

●Storage Condition

Storage Environment

Corrosive Gases

Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases.

Temperature Fluctuations

Since dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage, it is important to maintain the temperature-controlled environment.

●Design of Land Pattern

When designing printed circuit boards, the shape and size of the lands must allow for the

●Adhesives

When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. Requirements for Adhesives

They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board.

They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly.

They should not corrode the circuit board or chip material.

They should be a good insulator.

They should be non-toxic, and not produce harmful gases, nor be harmful when touched. Application Method

It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor adhesion and overflow into the land, respectively.

Adhesive hardening Characteristics

To prevent oxidation of the terminations, the adhesive must harden at 160℃or less, within 2minutes or less.

●Mounting

Mounting Head Pressure

Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during mounting.

Bending Stress

●Flux

●Soldering

Method

-Overall heating

Reflow soldering

-Local heating

Flow soldering

-Single wave -Double wave

Classification

-Infrared rays -Hot plate

-VPS(vaporphase) -Air heater -Laser

-Light beam

*We recommend the reflow soldering method.

Soldering Profile

To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent

graph.

℃

[**************]50

℃

300250200

15010050

60~120sec3~4sec

Reflow Soldering Flow Soldering

Manual Soldering

Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot

soldering iron tip comes into direct contact with the end terminations, and operator's carelessness

Amount of

Solder

Cooling

Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference(△T) must be less than 100℃6-6. Cleaning

Notes for Separating Multiple, Shared PC Boards.

A multi-PC board is separated into many individual circuit boards after soldering has been

completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending of the circuit board.

■CROSS REFERENCE

P/N

①COMPANY

COMPANY

MODEL(MLCC)

0201(0603)0402(1005)0603(1608)0805(2012)

②SIZE (EIA/JIS)

1206(3216)1210(3225)1808(4520)1812(4532)2220(5750)

SAMSUNG

CL [***********]

AVX --[***********]1018081812-

JOHANSON

--R07R14R15R18S41R29S43-

KEMET C -[***********][1**********]220

KYOCERA

CM [***********]55

MURATA GRM 3336394042-642-2-43-244-1

NOVACAP

--[***********][1**********]221

PANASONIC

ECJ Z 01234---

ROHM MCH -1518213132-43-

TAIYO -YUDEN MK [***********]-432550

TDK C [***********][***********]

VITRAMON

VJ -[***********]1018081812-

COG(NPO)C A N G CG COG/CHN C A C COG/CHA

P2H(N150)R2H(N220)S2H(N330)

③

TEMPERATURE CHARACTERISTIC

U2J(N750)

S2L X7R Z5U T2H(N470)

P R S T U L B E

S 13O Z Y C E

------W Z

------R(X)U

P R S T U SL X7R -

P2H R2H S2H T2H U2J SL X7R Z5U

------B Z

P R S T U G B -

----UJ SL C E

P R S T U SL BJ -

PH RH SH TH UJ SL X7R(B)Z5U

------Y(X)U

Y5V F G Y V Y5V Y5V Y F F F Y5V -

④NOMINAL CAPACITANCE ⑤CAPACITANCE TOLERANCE

6.3V 10V 16V 25V 50V 100V 200V 250V 500V 630V 1000V 2000V 3000V 4000V NICKEL BARRIER

⑦TERMINATION

Ag/PdBULK(VINYL)PAPER TAPING

⑧PACKAGE

PLASTIC TAPING BULK CASE

E P

1, 37

E, U -P B C

192, 4

-(NONE)T, R

Q P O A B C D E G H I J K -N

6Z Y 3512V 7-A G H J T

V B:±0.1㎊

-[***********]-501-102202302

EX) 103=10,000㎊C:±0.25㎊

9843512-------C -----D:±0.5㎊

[***********][***********]04000A B B T, L H, N C

221=220㎊

F:±1%

6.[***********]5006301K 2K 3K -(GRM)(GR)PB PT PT PC

225=2,200,000㎊=2.2㎌G:±2%

--[***********]501-[1**********]2N P *T --J:±5%

1R5=1.5㎊K:±10%0J 1A 1C 1E 1H 2A 2D ---------X E,V,W F, Y C

010=1㎊

Z:-20~+80%

J L E T U -----------B T T -0J 1A 1C 1E 1H 2A -2E -2J 3A 3D 3F ---B T ----J X A B C -E -G -H -X F B C, P T, R G

M:±20%

-43251--------(MCH)(MC)-K, L P, Q C

⑥RATED VOLTAGE

SAMSUNG :CL10B104KA8NNNC

AVX :06033C104KAT2A

JOHANSON :250R14W104KV6T

KEMET :C0603C104K3RAC

KYOCERA :CM105X7R104K25AT

MURATA :GRM188R71E104KA01D

NOVACAP :0603B104K250N_TM

PANASONIC :ECJ1EB1E104K

ROHM :MCH182C104KKN

TAIYO-YUDEN :TMK107BJ104K_T

TDK :C1608X7R1E104KT

VITRAMON :VJ0603Y104KXXMC

三星陶瓷电容规格书

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