2835贴片规格书

中之光电科技有限公司

ZT2835W0M1-****(0.2W)

规格书

2.8mm Medium Power SMT Hyper White Top LED

2.8 mm中功率贴片反射盖灌注型超亮发光二极管

Top View顶视

Features特征

• Package Size:2.8 (L) ×3.5(W) ×0.8 (T) mm

封装尺寸: 2.8 (长) ×3.5 (宽) ×0.8 (厚) mm • Silicone Packed

采用硅胶封装 •Super long lifetime

超长寿命 •Anti UV 防紫外线

•White colors are available in(1800K- 15000K) 可供白光(1800K- 15000K) •High CRI products

Side View侧视

高显色性产品

•Wide viewing angle (2θ1/2=120°) 宽角度 (2θ1/2=120°)

Applications 产品应用

•Indoor lighting: Fluorescent lamp, tube •室内照明:日光灯管、灯条

•Commercial illumination and displays: •商业照明显示:广告字、广告灯箱

Advertising words, light box

•LCD Backlighting •LCD背光源 •Decorative lighting: light strip •装饰照明:柔性灯条 •Automotive interior auxiliary lighting

•Other illumination and displays •其它照明和显示类

O

O

Fa

O

O

Part No. Description产品型号说明

Color Bin Limit色度代码;(at IF = 60 mA, Ta = 25 C )

O

Color Bin色坐标

常用BIN区(Common Bin)

可选BIN区(Optional Bin)

Typical Electro-Optical Characteristics Curves典型光-电特性曲线图

PACKAGE OUTLINE外形尺寸 (Units: mm)

0.8

Recommended Soldering 推荐焊接模式

Solder Pad

一、PRECAUTONS IN USE LED/使用LED注意事项;

LED Soldering condition/ LED焊接条件;

1:烙铁焊接:烙铁最高30W尖端温度不超过300℃;焊接时不超过3秒;

Manual soldering:iron Maximum 30W,iron bit temperature can not over 300 degree;soldering time should not be more than 3 seconds; Cleanout/清洗;

当用化学品清洗LED胶体时须特别小心,因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙酮,可用乙醇擦拭浸渍,时间在常温下不超过2分钟。

Utmost care must be taken when using chemical to clean LED,Some chemical can damage the surface of epoxy and will cause colour fading,such as trichloroethylene,acetone etc ethanol can be used to wipe and dip under normal temperature,but the time should not be more than 3 minutes。 ESD Protecction/静电防护;

静电和电流的急剧升高会对LED产生损伤,LED系列产品使用时请使用防静电装置,如防静电带和手套。 Excessive ESD and current could damage the LED,protection equipment such bands when operate LED Product。

注意:使用时人体放电模式HBM

Attention:Human Boby discharge Mode HBM

我公司的LED产品不仅要经过生产线的自动分档测试仪检测、分档,而且要经过严格的可靠性试验,这些试验标准都是采用业内公认的MIL-STD-。 Our LED chips are classified by machine in production line;and strictly perfromed the reliability test according to world wide standard MIL-STD-.

Test circuit 测试电路;

Handling precautions处理注意事项; 1.Over-current-proof过电流保护;

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen).

客户必须采用电阻进行保护,否则轻微电压漂移将导致电流发生巨大变化 2.Storage Baking/储存烘烤;

2.1 It is recommended to store the products in the following conditions推荐在下列环境下储存:Humidity: 60% R.H. Max. 湿度: 相对湿度≤60% ;Temperature: 5℃~30℃温度: 5℃~30℃.

2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <30% R.H. after the package is opened, the products should be used within 24hrs or they should be kept stored at ≦20% R.H. with zip-lock sealed. It is recommended to bake before soldering when the pack is unsealed after 24hrs. The conditions are as followings:

以密封袋储存保质期: 12 个月, 5℃~30℃ ,相对湿度<30% 。产品开封后应在24小时内使用,或在相对湿度≦20%环境下储存,并以拉连锁密封。如包装敞开超过72小时,我们建议焊接前对产品进行烘烤。烘烤条件如下:80±3℃ x(10~12hrs) and <5%RH。

Reflow Soldering Instruction回流焊说明;

NOTE:

Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.回流焊接应该少于2次, 在第一和第二次焊接之间要求有冷却至常温的过程.

Taping Specifications包装规格

REEL(178×8mm)

REEL(0.075×220×210mm)

REEL(105×184×184mm)

1.Package Quantity: 2000 pcs/Reel 每卷2000颗

2.All dimensions are in millimeters(tolerance:±0.2) 所有尺寸单位为mm,公差为±0.2。

+

Dimensions in mm

中之光电科技有限公司

ZT2835W0M1-****(0.2W)

规格书

2.8mm Medium Power SMT Hyper White Top LED

2.8 mm中功率贴片反射盖灌注型超亮发光二极管

Top View顶视

Features特征

• Package Size:2.8 (L) ×3.5(W) ×0.8 (T) mm

封装尺寸: 2.8 (长) ×3.5 (宽) ×0.8 (厚) mm • Silicone Packed

采用硅胶封装 •Super long lifetime

超长寿命 •Anti UV 防紫外线

•White colors are available in(1800K- 15000K) 可供白光(1800K- 15000K) •High CRI products

Side View侧视

高显色性产品

•Wide viewing angle (2θ1/2=120°) 宽角度 (2θ1/2=120°)

Applications 产品应用

•Indoor lighting: Fluorescent lamp, tube •室内照明:日光灯管、灯条

•Commercial illumination and displays: •商业照明显示:广告字、广告灯箱

Advertising words, light box

•LCD Backlighting •LCD背光源 •Decorative lighting: light strip •装饰照明:柔性灯条 •Automotive interior auxiliary lighting

•Other illumination and displays •其它照明和显示类

O

O

Fa

O

O

Part No. Description产品型号说明

Color Bin Limit色度代码;(at IF = 60 mA, Ta = 25 C )

O

Color Bin色坐标

常用BIN区(Common Bin)

可选BIN区(Optional Bin)

Typical Electro-Optical Characteristics Curves典型光-电特性曲线图

PACKAGE OUTLINE外形尺寸 (Units: mm)

0.8

Recommended Soldering 推荐焊接模式

Solder Pad

一、PRECAUTONS IN USE LED/使用LED注意事项;

LED Soldering condition/ LED焊接条件;

1:烙铁焊接:烙铁最高30W尖端温度不超过300℃;焊接时不超过3秒;

Manual soldering:iron Maximum 30W,iron bit temperature can not over 300 degree;soldering time should not be more than 3 seconds; Cleanout/清洗;

当用化学品清洗LED胶体时须特别小心,因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙酮,可用乙醇擦拭浸渍,时间在常温下不超过2分钟。

Utmost care must be taken when using chemical to clean LED,Some chemical can damage the surface of epoxy and will cause colour fading,such as trichloroethylene,acetone etc ethanol can be used to wipe and dip under normal temperature,but the time should not be more than 3 minutes。 ESD Protecction/静电防护;

静电和电流的急剧升高会对LED产生损伤,LED系列产品使用时请使用防静电装置,如防静电带和手套。 Excessive ESD and current could damage the LED,protection equipment such bands when operate LED Product。

注意:使用时人体放电模式HBM

Attention:Human Boby discharge Mode HBM

我公司的LED产品不仅要经过生产线的自动分档测试仪检测、分档,而且要经过严格的可靠性试验,这些试验标准都是采用业内公认的MIL-STD-。 Our LED chips are classified by machine in production line;and strictly perfromed the reliability test according to world wide standard MIL-STD-.

Test circuit 测试电路;

Handling precautions处理注意事项; 1.Over-current-proof过电流保护;

Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn out will happen).

客户必须采用电阻进行保护,否则轻微电压漂移将导致电流发生巨大变化 2.Storage Baking/储存烘烤;

2.1 It is recommended to store the products in the following conditions推荐在下列环境下储存:Humidity: 60% R.H. Max. 湿度: 相对湿度≤60% ;Temperature: 5℃~30℃温度: 5℃~30℃.

2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <30% R.H. after the package is opened, the products should be used within 24hrs or they should be kept stored at ≦20% R.H. with zip-lock sealed. It is recommended to bake before soldering when the pack is unsealed after 24hrs. The conditions are as followings:

以密封袋储存保质期: 12 个月, 5℃~30℃ ,相对湿度<30% 。产品开封后应在24小时内使用,或在相对湿度≦20%环境下储存,并以拉连锁密封。如包装敞开超过72小时,我们建议焊接前对产品进行烘烤。烘烤条件如下:80±3℃ x(10~12hrs) and <5%RH。

Reflow Soldering Instruction回流焊说明;

NOTE:

Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process.回流焊接应该少于2次, 在第一和第二次焊接之间要求有冷却至常温的过程.

Taping Specifications包装规格

REEL(178×8mm)

REEL(0.075×220×210mm)

REEL(105×184×184mm)

1.Package Quantity: 2000 pcs/Reel 每卷2000颗

2.All dimensions are in millimeters(tolerance:±0.2) 所有尺寸单位为mm,公差为±0.2。

+

Dimensions in mm


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